Kingston 4GB 1866MHz DDR3 CL10 DIMM HyperX Fury RAM – White

Power Supply: VDD=1.2V Typical
VDDQ = 1.2V Typical
VPP – 2.5V Typical
VDDSPD=2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for  data, strobe, and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Dual-rank
On-board I2 serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB: Height 1.23” (31.25mm)
RoHS Compliant and Halogen-Free

FEATURES

• JEDEC standard 1.5V (1.425V ~1.575V) Power Supply

• VDDQ = 1.5V (1.425V ~ 1.575V)

• 800MHz fCK for 1600Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 11, 10, 9, 8, 7, 6

• Programmable Additive Latency: 0, CL – 2, or CL – 1 clock

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not

allow seamless read or write [either on the fly using A12 or

MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE < 95°C

• Asynchronous Reset

• Height 1.291” (32.80mm) w/heatsink, single sided

Component

Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP = 2.5V Typical
VDDSPD = 2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for  data, strobe, and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Dual-rank
On-board I2 serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8  via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB: Height 1.23” (31.25mm)
RoHS Compliant and Halogen-Free

Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP = 2.5V Typical
VDDSPD = 2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for  data, strobe, and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Single-rank
On-board I2 serial presence-detect (SPD) EEPROM
8 internal banks; 2 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8  via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB: Height 1.18” (30.00mm)
RoHS Compliant and Halogen-Free